• ibhanela04

Isingeniso senqubo yokukhiqiza ye-PCB yegolide yomunwe wegolide

PCB iminwe yegolideubheke onqenqemeni metallization ingxenye yokwelapha on theIbhodi le-PCB.
Ukuze kuthuthukiswe ukusebenza kukagesi nokumelana nokugqwala kwesixhumi, iminwe yegolide ivamise ukusebenzisa inqubo yegolide yokucwenga.Okulandelayo inqubo ejwayelekile yokukhiqiza yegolide ye-PCB yomunwe wegolide:
Ukuhlanza: Okokuqala, imiphetho ye-Ibhodi le-PCBkudingeka zihlanzwe futhi zikhishwe ukuze kuqinisekiswe ukushelela nokuhlanzeka kwendawo.
Ukwelashwa okungaphezulu: Okulandelayo, unqenqema lwe-PCB ludinga ukuphathwa ngaphezulu, imvamisa ngokusebenzisa i-chemical copper plating, pickling nezinye izinqubo zokususa ukungcola nezingqimba ze-oxide kulungiselelwa ukufakwa kwegolide okulandelayo.
I-Gold Plating: Ngemva kokwelashwa okungaphezulu, umunwe wegolide uzohamba ngenqubo ye-electroplating.Ngokufaka isixazululo sensimbi ku-emaphethelweni ebhodi le-PCBkanye nokusebenzisa okwamanje, insimbi ifakwa phezulu ukuze yakhe ungqimba olufanayo lokuvikela lwensimbi.
Ukuhlanza nokuhlola: Ngemva kokuphothulwa kokucwecwa kwegolide, iminwe yegolide idinga ukuhlanzwa ukuze kukhishwe amakhemikhali asele kanye nokungcola.Ukuhlolwa kwekhwalithi kuye kwenziwa ukuze kuqinisekiswe ukuthi ikhwalithi nokuqina kongqimba lwe-metalization yomunwe wegolide luhlangabezana nezidingo.Lezi zinyathelo zenqubo ziqinisekisa izinga legolide le-plating nokusebenza okuhle kukagesi wePCB iminwe yegolide, kuyilapho futhi ithuthukisa ukumelana nokugqwala kwayo kanye nokuzinza kokuxhumeka.

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Isikhathi sokuthumela: Mar-07-2024