I-BGA professional rework machine iyisisetshenziswa esikhethekile esisetshenziselwa ukulungisa ama-chips e-BGA (ukupakishwa kwe-ball array).I-BGA chipsziwubuchwepheshe bokupakisha obunokuminyana okuphezulu obuvame ukusetshenziswa kumabhodi omama wezinto zikagesi.
Ngenxa yendlela yokushisela eyinkimbinkimbi, imishini yobuchwepheshe nobuchwepheshe kuyadingeka ukuze kulungisweI-BGA chips.Imishini yokusebenza kabusha yobungcweti be-BGA ngokuvamile ihlanganisa le misebenzi elandelayo:
Isistimu yokushisa: isetshenziselwa ukushisa i-chip ye-BGA ukuze kuthambise amabhola e-solder.
Isistimu yokulawula: isetshenziselwa ukulawula amapharamitha afana nesikhathi sokushisa, izinga lokushisa, nemodi yokushisa ukuze kuqinisekiswe ukuthi inqubo yokulungisa izinzile futhi inembile.
Isistimu yomoya oshisayo: isetshenziselwa ukomisa futhiama-chips e-BGA apholile, kanye nokulawula ukushisa phakathi nayo yonke inqubo yokulungisa.Isistimu yombono: isetshenziselwa ukuthola nokubeka ama-chip e-BGA ukuze kuqinisekiswe ukuqondana okulungile nokuma.
Amathuluzi okulungisa kanye nezinsiza: okuhlanganisa amabhola e-solder, i-solder fluid, ama-scrapers, njll., asetshenziselwa ukuhlanza amaphedi e-solder nokulungisa amalunga e-solder.Ngosizo lwemishini yokulungisa kabusha ye-BGA, ochwepheshe bangathola futhi balungise ama-chip e-BGA ngokunembile, bathuthukise ukusebenza kahle kokulungisa kanye nekhwalithi.
Ukusebenzisa umshini onjalo kugwema amaphutha nokulimala okungenzeka ekulungiseni okujwayelekile kwezandla, kuyilapho kuqinisekisa ukwethembeka nokuqina kwemiphumela yokulungisa.Ngethemba ukuthi lokhu kuyasiza!Uma uneminye imibuzo eyengeziwe, sicela ukhululeke ukubuza.
Isikhathi sokuthumela: Oct-12-2023