Nanga amanye amanqaku aphambili ekufuneka uwaqwalasele xa usebenzisa uhlolo lweX-reyi ukujongaPCBA umgangatho:

● Ukubekwa kwecandelo: Ukuhlolwa kwe-X-reyi kunokuqinisekisa ukuchaneka kunye nokulungelelaniswa kwamacandelo kwi-PCB.Iqinisekisa ukuba onke amacandelo akwiindawo ezichanekileyo kwaye alungelelaniswe ngokuchanekileyo.

● Amalungu eSolder: Ukuhlolwa kwe-X-reyi kunokubona naziphi na iziphene okanye izinto ezingahambi kakuhle kwiindawo zesolder, njengokungonelanga okanye ukugqithiswa kwezixa zesoda, ibridging ye-solder, okanye ukungamanzi kakuhle.Inika ujongo olucacileyo kumgangatho wokudityaniswa kwe-solder.

● IiSekethe eziMfutshane kunye nokuVuleka: Uhlolo lwe-X-reyi lunokubona naziphi na iisekethe ezinokuthi zibe zifutshane okanye zivuleke kwi-PCB, ezinokubangelwa kukungalungelelani kakuhle okanye ukusoda ngokungafanelekanga kwamalungu.

● I-Delamination and Cracks: I-X-reyi inokubonisa nayiphi na i-delamination okanye iintandaIileya zangaphakathi zePCBokanye phakathi kwamaleko, ukuqinisekisa ukuthembeka kwesakhiwo sebhodi.

● Uhlolo lwe-BGA: Uhlolo lwe-X-reyi luluncedo ngakumbi ekuhloleni uluhlu lwegridi yebhola (BGA) amacandelo.Inokuqinisekisa umgangatho weebhola ze-solder phantsi kwephakheji ye-BGA, iqinisekisa ukudibanisa okufanelekileyo.

● Ukuqinisekiswa kwe-DFM: Uhlolo lwe-X-reyi lusenokusetyenziswa ukuqinisekisa uyilo lokwenziwa kwezinto (DFM) imiba ye-PCB.Inceda ekuchongeni iziphene kuyilo kunye nemiba enokubakho yemveliso.

Ngokubanzi, ukuhlolwa kwe-X-reyi sisixhobo esixabisekileyo sokuvavanya umgangatho we-PCBA.Inika imbono eneenkcukacha ngobume bangaphakathi, ivumela uhlolo olucokisekileyo nokuqinisekisa ukuba ibhodi iyahlangabezana nemigangatho yomgangatho efunekayo.