Umgaqo wePCBA reflow solderingbubuchule obuxhaphakileyo obusetyenziswa kumphezulu wokunyusela ukuthengisela izinto zombane kwiibhodi zesekethe eziprintiweyo (PCBs).

Umgaqo we-reflow soldering usekelwe kwimigaqo yokuqhuba ubushushu kunye nokunyibilika kwezinto eziphathekayo.Intlama ye-solder ine-alloy yesinyithi, enesiqhelo ngelothe, i-tin, kunye nezinye iindawo ezisezantsi zokunyibilika.

Emva koko, i-surface mount components (SMD) ibekwe ngokuchanekileyo kwi-solder paste.Okulandelayo, i-PCB kunye namacandelo adibeneyo adluliselwe kwi-oven yokubuyisela, apho iprofayili yokushisa ilawulwa.I-Reflow soldering ifuna inkqubo yokufudumeza kunye nokupholisa kwizigaba ezibini ezinkulu.Inqanaba lokufudumala: Iqondo lokushisa liyenyuka ngokuthe ngcembe, libangela ukuba i-solder paste iqale ukunyibilika.I-metallic alloy kwi-solder paste iyanyibilika kwaye yenze imeko yolwelo.

Ngethuba le nkqubo, iqondo lokushisa kufuneka lifikelele kwinqanaba elaneleyo lokuqinisekisa ukuba i-solder joints iyanyibilika, kodwa ingabi phezulu kakhulu ukonakalisa amanye amacandelo kwi-oven yokubuyisela okanye i-PCB. kunye noqhagamshelwano ngoomatshini phakathi kwePCB kunye namacandelo.Xa i-solder joints ifikelela kubushushu obufanelekileyo, amasuntswana ebhola entsimbi kwi-solder paste aqala ukwenza iibhola zetin.Inqanaba lokupholisa: Iqondo lobushushu kwi-oven reflow liqala ukuhla, libangela ukuba intlama ye-solder iphole ngokukhawuleza kwaye iqine, yenze i-solder ezinzileyo.
Emva kokuba i-solder ipholile, i-solder paste iqinisa kwaye idibanise ngokuqinileyo i-PCB kunye namacandelo kunye.Isitshixo sokuphinda sitshintshe i-soldering kukulawula iphrofayili yobushushu kwi-oven yokubuyisela ukuqinisekisa ukunyibilika okupheleleyo kwe-solder paste, kunye namalungu e-solder. yenza uqhagamshelo oluthembekileyo nolomeleleyo kunye nePCB kunye namalungu.

Ukongezelela, umgangatho we-solder paste nawo uchaphazela umgangatho we-soldering, ngoko ke ukukhetha ukuqulunqwa kwe-solder paste efanelekileyo kubalulekile.Isishwankathelo, umgaqo we-PCBA reflow sol.