Le miba ilandelayo kufuneka iqatshelwe xa kuqhutywa ulawulo lomgangatho we-PCBA (iNdibano yeBhodi yeSekethe eprintiweyo):
Jonga ufakelo lwecandelo: Jonga ukuchaneka, indawo kunye nomgangatho we-weldingamacandeloukuqinisekisa ukubaamacandelozifakwe ngokuchanekileyo njengoko zifunwa.
Ukuweldaukuhlolwa komgangatho: Jonga umgangatho we-welding joints, kubandakanywa ukunyaniseka kwe-welding, i-welding slag kunye nobushushu be-welding.
Uvavanyo lokuqhubeka komgca: Yenza uxhulumaniso lomgca kunye novavanyo oluqhubekayo ukuqinisekisa ukuba akukho zifutshane okanye iisekethe ezivulekileyo.
Ukuhlolwa kwekhwalithi yesikrini sesilika: Jonga ukucaca, ukuchaneka kokulungelelaniswa kunye nokuphelela kwesikrini sesilika.
Ukuhlolwa kwePad: Jonga umgangatho wepadi, kubandakanywa ukumila kwephedi, ukugquma kunye nokuthotyelwa.Ukuhlolwa kwembonakalo: Yenza uhlolo lwembonakalo ukuqinisekisa ukuba ukubonakala kwePCBA kugqityiwe, akukho monakalo kunye nokungcola.
Uvavanyo olusebenzayo: Yenza uvavanyo olusebenzayo ukujonga ukuba ukusebenza kunye nomsebenzi webhodi yesekethe kuyahlangabezana neemfuno.
Ixesha lokuposa: Feb-26-2024