PCB iminwe yegolidebhekisa kwinxalenye yonyango ye-metallization edge kwiibhodi PCB.
Ukuze kuphuculwe ukusebenza kombane kunye nokumelana nokubola kwekhonkco, iminwe yegolide ihlala isebenzisa inkqubo yegolide yokubeka.Oku kulandelayo yinkqubo yokuvelisa igolide yomnwe wePCB yegolide:
Ukucoca: Okokuqala, imida yeibhodi PCBkufuneka icocwe kwaye ihlanjululwe ukuze kuqinisekiswe ukuguda kunye nokucoceka komphezulu.
Unyango lwakumphezulu: Okulandelayo, umphetho wePCB kufuneka uphathwe umphezulu, ngokuqhelekileyo ngokutyalwa kwekhemikhali yobhedu, ukucholwa kunye nezinye iinkqubo zokususa ubumdaka kunye neengqimba zeoksidi ukulungiselela ukufakwa kwegolide okulandelayo.
Ukufakwa kwegolide: Emva konyango lomphezulu, umnwe wegolide uya kuhamba kwinkqubo ye-electroplating.Ngokugquma isisombululo sesinyithi kwiemphethweni webhodi PCBkunye nokusebenzisa okwangoku, isinyithi sifakwe phezu komhlaba ukuze senze umaleko okhuselayo wesinyithi.
Ukucoca nokuvavanya: Emva kokuba kugqitywe ukucwenga kwegolide, iminwe yegolide kufuneka icocwe ukuze kususwe iikhemikhali ezishiyekileyo kunye nokungcola.Ukuhlolwa komgangatho emva koko kwenziwa ukuze kuqinisekiswe ukuba umgangatho kunye nobukhulu be-metallization layer yomnwe wegolide uhlangabezana neemfuno.La manyathelo enkqubo aqinisekisa umgangatho wokubekwa kwegolide kunye nokusebenza kakuhle kombanePCB iminwe yegolide, ngelixa ikwaphucula ukuxhathisa ukubola kunye nokuzinza koqhagamshelwano.
Ixesha lokuposa: Mar-07-2024