Ifotoplate: Ukusebenzisa itekhnoloji yefotoplate ukuhambisa iipatheni zesekethe kwi-substrate.Izinto zobhedu ezigqithisileyo zisuswa yifotomask kunye nekhemikhali etching ukwenza ipateni yesekethe efunwayo.Unyango olufakwe ngegolide: Unyango olufakwe ngegolide lwenziwa kwinxalenye yomnwe wegolide ukuphucula ukuhanjiswa kombane kunye nokuxhathisa ukubola.Ngokuqhelekileyo, indlela ye-electroplating isetyenziselwa ukufaka ngokufanayo izinto zetsimbi kumphezulu womnwe wegolide.I-Welding kunye nendibano: Weld kwaye uhlanganise amacandelo kunye nebhodi ye-PCB ukuqinisekisa ukuba i-solder joints iqinile kwaye ithembekile.Sebenzisa iteknoloji yokunyuswa komhlaba (SMT) okanye i-plug-in soldering technology, khetha ngokweemfuno ezithile.Ukuhlolwa komgangatho kunye novavanyo: Ukuhlolwa komgangatho ongqongqo kunye novavanyo lwenziwa ngexesha lenkqubo yokuvelisa ukuqinisekisa ukuba ibhodi yePCB yomnwe wegolide ihlangabezana neenkcukacha kunye neemfuno zomgangatho.
Kubandakanya ukuhlolwa okubonakalayo, uvavanyo lweempawu zombane, uvavanyo lwe-impedance yoqhagamshelwano, njl. Ukucocwa kunye nokugquma: Coca i-PCB ye-Goldfinger egqityiweyo ukususa ukungcola komhlaba kunye neentsalela.Unyango lwe-anti-corrosion coating lwenziwa njengoko lufunekayo ukuphucula ukuxhathisa ukubola kwebhodi ye-PCB.Ukupakishwa kunye nokuhanjiswa: Pakisha ngokufanelekileyo i-PCB ye-Golden Finger egqityiweyo ukunqanda umonakalo womzimba okanye ungcoliseko.Emva kokugqiba uhlolo lokugqibela, hambisa kumthengi ngexesha.Inkqubo yokuvelisa ibhodi ye-Goldfinger PCB ifuna ukuchaneka okuphezulu kunye nolawulo olungqongqo lokuqinisekisa umgangatho wemveliso kunye nokuzinza.Siya kusebenza ngokungqongqo ngokungqinelana nenkqubo ingentla ukuze sikubonelele ngeemveliso zebhodi zebhodi yegolide yomnwe wePCB.