Ka lebaka la mokhoa oa eona o rarahaneng oa ho tjheseletsa, lisebelisoa tsa setsebi le theknoloji lia hlokahala ho lokisaLisebelisoa tsa BGA.Mechini ea rework ea BGA hangata e kenyelletsa mesebetsi e latelang:

Sistimi ea ho futhumatsa: e sebelisetsoang ho futhumatsa chip ea BGA ho nolofatsa libolo tsa solder.

Sistimi ea taolo: e sebelisetsoang ho laola likarolo tse kang nako ea ho futhumatsa, mocheso le mokhoa oa ho futhumatsa ho netefatsa hore mokhoa oa ho lokisa o tsitsitse ebile o nepahetse.

Setsi sa moea o chesang: se sebedisoang ho omella leli-chips tse pholileng tsa BGA, hammoho le ho laola mocheso nakong ea ts'ebetso eohle ea ho lokisa.Sistimi ea pono: e sebelisetsoang ho bona le ho beha li-chips tsa BGA ho netefatsa ho lokisoa le maemo a nepahetseng.

Lisebelisoa tsa ho lokisa le lisebelisoa: ho kenyelletsa le libolo tsa solder, solder fluid, scrapers, joalo-joalo, tse sebelisetsoang ho hloekisa liphaephe tsa solder le ho lokisa manonyeletso a solder.Ka thuso ea mechini e ncha ea BGA, litsebi tsa theknoloji li ka fumana le ho lokisa li-chips tsa BGA ka nepo, li ntlafatsa ts'ebetso le boleng ba tokiso.

Ho sebelisa mochine o joalo ho qoba liphoso le tšenyo e ka hlahang litokisong tse tloaelehileng tsa matsoho, ha ho ntse ho netefatsa ho tšepahala le ho tšoarella ha liphello tsa tokiso.Rea tšepa hore sena se thusa!Haeba u na le lipotso tse ling, ka kopo ikutloe u lokolohile ho botsa.