Here are some key points to consider when using X-ray inspection for checking PCBA quality:

   ● Component Placement: X-ray inspection can verify the accuracy and alignment of the components on the PCB. It ensures that all components are in the correct locations and correctly oriented.

   ● Solder Joints: X-ray inspection can identify any defects or anomalies in the solder joints, such as insufficient or excessive amounts of solder, solder bridging, or poor wetting. It provides a detailed look at the quality of the solder connections.

   ● Short Circuits and Opens: X-ray inspection can detect any potential short circuits or opens in the PCB, which may be caused by misalignment or improper soldering of components.

   ● Delamination and Cracks: X-rays can reveal any delamination or cracks in the PCB's internal layers or between the layers, ensuring the structural integrity of the board.

   ● BGA Inspection: X-ray inspection is especially useful for inspecting ball grid array (BGA) components. It can verify the quality of the solder balls underneath the BGA package, ensuring proper connections.

   ● DFM Verification: X-ray inspection can also be used to verify the design for manufacturability (DFM) aspects of the PCB. It helps to identify design flaws and potential manufacturing issues.

Overall, X-ray inspection is a valuable tool for assessing the quality of a PCBA. It provides a detailed view of the internal structure, allowing for thorough inspection and ensuring that the board meets the required quality standards.