A cikinSMTsurface Dutsen taro tsari, saura abubuwa ana samar a lokacin daPCB tarosoldering lalacewa ta hanyar juyi da solder manna, wanda ya hada da daban-daban sassa: Organic kayan da decomposable ions.Kayayyakin halitta suna da lalacewa sosai, kuma ragowar ions akan pads ɗin na iya haifar da kurakurai na gajeren lokaci.Bugu da ƙari, abubuwa da yawa da suka rage a kanPCBAallon yana da ɗan datti kuma basu cika buƙatun tsabta na mai amfani na ƙarshe ba.Saboda haka, babu makawa don tsaftacewaPCBAallo.Duk da haka,PCBA allobai kamata a tsaftace shi da gangan ba, kuma dole ne a bi tsauraran buƙatu da taka tsantsan yayin amfani da aPCBAinjin tsaftacewa.
Anan ga cikakken bayani akan wasu al'amuran gama gari lokacinPCBA kwamitintsarin tsaftacewa:
Da fari dai, bayan taro da kuma soldering nabuga allon kewayawa Abubuwan da aka gyara, tsaftacewa ya kamata a yi da wuri-wuri don cire ragowar ruwa, solder, da sauran gurɓatattun abubuwa daga allon da'irar da aka buga (saboda ragowar jujjuyawar za ta taurare a hankali kan lokaci, ƙirƙirar abubuwa masu lalata kamar ƙarfe halide salts).A gefe guda, yayin tsaftacewa, yana da mahimmanci don guje wa abubuwan tsaftacewa masu cutarwa daga shigar da kayan aikin lantarki waɗanda ba a rufe su gaba ɗaya don hana cutarwa ko lahani ga abubuwan da ke ciki.
Bayan tsaftace kayan aikin da'irar da aka buga, sai a sanya su a cikin tanda a zafin jiki na 40 ~ 50 ° C kuma a gasa su tsawon minti 20 ~ 30, kuma kada a taɓa su da hannu da hannu kafin su bushe gaba daya.Bugu da ƙari, tsarin tsaftacewa bai kamata ya shafikayan lantarki, Alamomi, kayan haɗin gwiwa, da allon da'ira da aka buga
Lokacin aikawa: Janairu-22-2024